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1
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Advances in nanoengineering : electronics, materials, assembly



London : Imperial College Press ; Singapore ; Hackensack, NJ : Distributed by World Scientific Pub., [2007]

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entries 2-55
2
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Redox polymers for energy and nanomedicine



[Cambridge] : Royal Society of Chemistry, [2021]

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3
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Recent advancement in electronic devices, circuit and materials



New York : Nova Science Publishers, Inc., 2020.

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4
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Materials for electronics : silicon carbide and related materials : selected peer-reviewed papers fr


Asia-Pacific Conference on Silicon Carbide and Related Materials (2nd : 2019 : Beijing, China)
Zurich, Switzerland : TransTech, 2020.

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5
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Strontium titanate : synthesis, properties and uses



Hauppauge, New York : Nova Science Publishers, Inc., [2019]

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6
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Microelectronics failure analysis : desk reference



Materials Park, Ohio : ASM International, [2019]
Seventh edition.

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7
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ISTFA 2019.


International Symposium for Testing and Failure Analysis.
Materials Park : A S M International, 2019.

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8
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9
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Research and application of functional materials : ICSMR 2016


International Conference on Smart Materials Research (2nd : 2016 : Istanbul, Turkey)
Zurich, Switzerland : Trans Tech Publications, [2017]

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10
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ISTFA 2017 : conference proceedings from the 43rd International Symposium for Testing and Failure An


International Symposium for Testing and Failure Analysis (42nd : 2016 : Fort Worth, Tex.)
Materials Park, Ohio : ASM International, [2017]

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11
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Robust design of digital circuits on foil


Myny, Kris, 1980- author.
Cambridge : Cambridge University Press, 2016.

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12
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Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2


Chinese Materials Congress (2014 : Chengdu, China)
Pfäffikon, Switzerland : Trans Tech Publications Ltd, 2015.

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13
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14
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Advances in applied materials and electronics engineering III : selected, peer reviewed papers from


International Conference on Applied Materials and Electronics Engineering (AMEE 2014) (3rd : 2014 : Hong Kong, China)
Durnten-Zurich : Trans Tech Publications Ltd., 2014.

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15
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Automatic control and mechatronic engineering III : selected, peer reviewed papers from the 3rd Inte


International Conference on Automatic Control and Mechatronic Engineering (3rd : 2014 : Xiamen, China)
Pfaffikon, Switzerland : Trans Tech Publications Ltd, [2014]

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16
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Recent engineering decisions in industry : selected, peer reviewed papers from the 2014 2nd Internat


International Conference on Materials Science and Mechanical Engineering (2nd : 2014 : Taipei, Taiwan)
Switzerland : Trans Tech Publications, 2014.

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17
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6th Forum on New Materials : proceedings of the 6th Forum on New Materials, part of CIMTEC 2014-13th


Forum on New Materials (6th : 2014 : Montecatini Terme, Italy)
Switzerland : Trans Tech Publications Ltd., [2014]

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18
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Advances in functional and electronic materials : selected, peer reviewed papers from the Chinese Ma


Chinese Materials Conference (2012 : Taiyuan, China)
Durnten-Zurich, Switzerland : Trans Tech Publications, [2013]

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19
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20
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ISTFA 2013 : conference proceedings from the 39th International Symposium for Testing and Failure An


International Symposium for Testing and Failure Analysis (39th : 2013 : San Jose, Calif.)
Materials Park, Ohio : ASM International, 2013.

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21
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Polymer electronics


Geoghegan, Mark.
Oxford : Oxford University Press, 2013.

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22
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Applied materials and electronics engineering : selected, peer reviewed papers from the 2012 Interna


International Conference on Applied Materials and Electronics Engineering (2012 : Hong Kong, China)
Durnten-Zurich, Switzerland : Trans Tech Publications, [2012]

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23
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Optical, electronic materials and applications II : selected, peer reviewed papers from the 2nd Inte


International Conference on Optical, Electronic Materials and Applications (2nd : 2012 : Chongqing, China)
Stafa-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, [2012]

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24
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Thick films : properties, technology, and applications



New York : Nova Science Publishers, [2012]

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25
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ISTFA 2012 : conference proceedings from the 38th International Symposium for Testing and Failure An


International Symposium for Testing and Failure Analysis (38th : 2012 : Phoenix Convention Center)
Materials Park, Ohio : ASM International, 2012.

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26
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Microelectronics failure analysis : desk reference



Materials Park, Ohio : ASM International, [2011]
6th ed.

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27
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ISTFA 2011 : conference proceedings from the 37th International Symposium for Testing and Failure An


International Symposium for Testing and Failure Analysis (37th : 2011 : San Jose, Calif.)
Materials Park, OH : ASM International, 2011.

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28
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29
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New materials III : transparent conducting and semiconducting oxides, solid state lighting, novel su


Forum on New Materials (5th : 2010 : Montecatini Terme, Italy), issuing body.
Stafa-Zuerich ; Enfield, NH : Trans Tech Pubs. Ltd. on behalf of Techna Group, [2010]

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30
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Metamaterials : classes, properties and applications



New York : Nova Science Publishers, [2010]

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31
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ISTFA 2010 : conference proceedings from the 36th International Symposium for Testing and Failure An


International Symposium for Testing and Failure Analysis (36th : 2010 : Dallas, Tex.)
Materials Park, Ohio : ASM International, 2010.

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32
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33
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Istfa 2009 : CONFERENCE PROCEEDINGS FROM THE 35TH INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE AN


INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS (35TH: 2009: SAN JOSE, CALIF.)
MATERIALS PARK : ASM INTERNATIONAL, 2009.

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34
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ISTFA 2008 : conference proceedings of the 34th International Symposium for Testing and Failure Anal


International Symposium for Testing and Failure Analysis (34th : 2008 : Portland, Or.)
Materials Park, Ohio : ASM International, 2008.

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35
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The robot builder's cookbook


Bishop, O. N. (Owen Neville)
Amsterdam ; Boston ; London : Elsevier/Newnes, [2007]

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36
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ISTFA 2007 : proceedings of the 33rd International Symposium for Testing and Failure Analysis, Novem


International Symposium for Testing and Failure Analysis (33rd : 2007 : San Jose, Calif.)
Materials Park, OH : ASM International, [2007]

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37
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Polymers in electronics : market report


Cousins, Keith.
Shawbury, U.K. : Rapra, 2006.

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38
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ISTFA 2006 : Proceedings of the 32nd International Symposium for Testing and Failure Analysis, Novem


International Symposium for Testing and Failure Analysis (23rd : 2006 : Austin, Tex.)
Materials Park, OH : ASM International, 2006.

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39
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Electronic and optical properties of D-band perovskites


Wolfram, Thomas, 1936-
Cambridge, UK ; New York : Cambridge University Press, 2006.

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40
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ISTFA 2005 : Proceedings of the 31st International Symposium for Testing and Failure Analysis, Movem


International Symposium for Testing and Failure Analysis (31st : 2005 : San Jose, Calif.)
Materials Park, OH : ASM International, [2005]

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41
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Microelectronics failure analysis : desk reference



Materials Park, Ohio : ASM International, [2004]

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42
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Materials research to meet 21st century defense needs


National Research Council (U.S.). Committee on Materials Research for Defense After Next.
Washington, D.C. : National Academies Press, 2003.

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43
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ISTFA 2003 : proceedings of the 29th International Symposium for Testing and Failure Analysis, 2-6 N


International Symposium for Testing and Failure Analysis (29th : 2003 : Santa Clara, Calif.)
Materials Park, Ohio : ASM International, 2003.

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44
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Microelectronic failure analysis : desk reference : 2002 supplement



Materials Park, Ohio : ASM International, [2002]

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45
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Materials research to meet 21st century defense needs : interim report


National Research Council (U.S.). Committee on Materials Research for Defense After Next.
Washington, D.C. : National Academy Press, [2001]

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46
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47
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ISTFA 2001 : proceedings of the 27th International Symposium for Testing and Failure Analysis : 11-1


International Symposium for Testing and Failure Analysis (27th : 2001 : Santa Clara, Calif.)
Materials Park, OH : ASM International, [2001]

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48
Bestseller
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Silicides : fundamentals and applications : proceedings of the 16th Course of the International Scho


International School of Solid State Physics (16th : 1999 : Erice, Italy)
Singapore ; River Edge, NJ : World Scientific, [2000]

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49
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Hermeticity of electronic packages


Greenhouse, Hal.
Park Ridge, N.J. : Norwich, N.Y. : Noyes Publications, [2000]

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50
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Electric refractory materials



New York : Marcel Dekker, [2000]

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