entries 1-9
Defonseka, Chris, author.
Shrewsbury, Shropshire : Smithers Rapra, 2016.
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Blowing Agents and Foaming Processes Conference (15th : 2013 : Mainz, Germany)
Shawbury, Shrewsbury, Shropshire, UK : Smithers Information Ltd, [2013]
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Blowing Agents and Foaming Processes International Conference (14th : 2012 : Berlin, Germany), issuing body.
Berlin : Smithers Rapra Technology Limited, [2012]
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Blowing Agents and Foaming Processes International Conference (13th : 2011 : Düsseldorf, Germany), issuing body.
Düsseldorf : Smithers Rapra Technology Limited, 2011.
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Blowing Agents and Foaming Processes International Conference (12th : 2010 : Cologne, Germany), issuing body.
Cologne : Smithers Rapra Technology Limited, 2010.
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Mills, N. J. (Nigel J.)
Oxford : Butterworth Heinemann, 2007.
1st ed.
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Eaves, David.
Shrewsbury, U.K. : Rapra Technology Ltd., 2004.
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Mills, N. J. (Nigel J.)
Shrewsbury : Rapra Technology Ltd., ©2003.
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Singh, S. N.
Shawbury, U.K. : Rapra Technology Ltd., 2002.
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entries 10-17
International Conference on Advanced Materials and Structures (4th : 2011 : Timişoara, Romania)
Durnten-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2012.
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International Conference on Advances in Materials and Manufacturing Processes (2nd : 2011 : Guilin, China)
Durnten-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2012.
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Durnten-Zurich : TTP, Trans Tech Publications, 2011.
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International Conference on Advances in Materials and Manufacturing Processes (2010 : Shenzhen Shi, China), issuing body.
Stafa-Zurich, Switzerland ; USA : Trans Tech Publications, [2011]
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Sandera, Pavel.
Zurich : Trans Tech Publishers, 2011.
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International Workshop on Performance, Protection and Strengthening of Structures under Extreme Loading (3rd : 2011 : Lugano, Switzerland)
Durnten-Zurich : TTP, Trans Tech Publications, ©2011.
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Congress on Mechanical Properties of Solids (11th : 2008 : Universidad de Cádiz)
Stafa-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2010.
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Asia-Pacific Symposium on Engineering Plasticity and Its Applications (9th : 2008 : Taejŏn-si, Korea)
Singapore ; Hackensack, NJ : World Scientific, ©2009.
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