| Description |
1 online resource (712 pages) : illustrations. |
| Physical Medium |
polychrome |
| Description |
text file |
| Series |
Materials Science Forum,
1662-9752 ;
Volume 815
|
|
Materials science forum ; v. 815.
|
| Bibliography |
Includes bibliographical references at the end of each chapters and indexes. |
| Contents |
Advanced Functional Materials; Preface; Table of Contents; Symposium E: Materials in Microelectronic and Optoelectronic Industry; Process Control of Buried Layer Epitaxy by Barrel Type Furnace; Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing; Research on Surface Roughness of Acid Etched Silicon Wafers; Investigation of Chemical Vapor Deposited Graphene Film on Oxide Substrate; Ultrahigh Purity Copper Alloy Target Used Innanoscale ULSI Interconnects; Property of an AlGaN/GaN MIS Diode with Si3N4/Al2O3 Bilayer Gate Dielectric Films. |
|
A New Type of Self-Aligned Technology for RF and Microwave Graphene Field-Effect TransistorsElectron Beam Annealing for Component Optimization in Si-Sb-Te Material; Structures and Electronic Properties of a Si55 Cluster on DFTB Calculations; Surface Plasmon Enhanced Photoluminescence of the Rubrene Film by Silver Nanoparticles; Development of Precious Metal and its Alloy Sputtering Targets with High Performance; Rheological and Thermomechanical Properties of Meso and Non-Porous Silica Filled Epoxy Composites; Study of Black Center in Silicon Wafer for Solar Cell. |
|
Impurity Detection Method for High-Purity BCl3First-Principles Study on Electronic and Optical Properties of Kesterite and Stannite Cu2ZnSnS4 Photovoltaic Absorbers; Effect of Acetic Acid/Water Ratio on the Microstructure and Properties of LaNiO3 Thin Films by Metal Organic Solution Deposition; Symposium F: Electronic Materials; Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn-3.0Ag-0.5Cu Solder during Thermal Cycling. |
|
Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu SubstrateEffect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder; Influence of Dislocation Density on Micromechanical Characteristics of Cu6Sn5 and Cu3Sn; Microstructure and Dielectric Properties of (Ba, Ta) Co-Doped Sr2Nb2O7 Ceramics; Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate. |
|
Ferroelectric and Photovoltaic Properties of Mn-Doped Bismuth Ferrite Thin FilmsMagnetic Properties and Unusual Morphologies of Barium Ferrites Prepared by Electrospinning and Sol-Gel Auto-Combustion Method; Symposium G: Multiferroic Materials; Effects of Sm and Mn Co-Doping on Structural and Optical Properties of BiFeO3 Thin Films Prepared by Sol-Gel Technique; Effects of Ba and Ti Codoping on Stoichiometric and Nonstoichiometric BiFeO3 Multiferroic Ceramics; A Review on the Characteristics of the New Multiferroic Three-Ply Structure Ferroelectric-Ferromagnetic Nanocomposite. |
| Summary |
Collection of selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. The 127 papers are grouped as follows: Symposium E: Materials in Microelectronic and Optoelectronic Industry; Symposium G: Multiferroic Materials; Symposium H: Smart Materials; Symposium I: Vanadium-Titanium And Rare Earth Functional Materials; Symposium J: Biomedical Materials; Symposium K: High Performance And Functional Polymer and Composite Materials. |
| Local Note |
eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America |
| Subject |
Electronics -- Materials -- Congresses.
|
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Electronics -- Materials. |
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Smart materials -- Research -- Congresses.
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Smart materials -- Research. |
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Smart materials. |
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Rare earths -- Research -- Congresses.
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Rare earths. |
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Research. |
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Biomedical materials -- Research -- Congresses.
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Biomedical materials -- Research. |
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Composite materials -- Research -- Congresses.
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Composite materials -- Research. |
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Composite materials. |
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Polymers -- Research -- Congresses.
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Polymers -- Research. |
| Genre/Form |
Electronic books.
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Conference papers and proceedings.
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Conference papers and proceedings.
|
| Added Author |
Han, Yafang, editor.
|
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Gu, Zhongwei, editor.
|
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Fu, Qiang, 1963- editor.
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| Other Form: |
Print version: Chinese Materials Congress (2014 : Chengdu, China). Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. Pfäffikon, Switzerland : Trans Tech Publications Ltd, ©2015 712 pages Materials science forum ; Volume 815 1662-9752 9783038353942 |
| ISBN |
3038267805 (e-book) |
|
9783038267805 (electronic book) |
|
9783038353942 |
|
