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Bestseller
Conference
International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China)
Title
Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / edited by Yanwen Wu.
Publication Info.
Stafa-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, [2011]
©2011
Online access
Online eBook. Access restricted to current Rider University students, faculty, and staff.
Instructions for reading/downloading this eBook
Item Status
Description
1 online resource (pages).
text file
Series
Key engineering materials,
1662-9795 ;
v. 460-461
Key engineering materials ; v. 460/461.
Local Note
eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America
Subject
Electronic apparatus and appliances -- Congresses.
Electronic apparatus and appliances.
Electronic packaging -- Congresses.
Electronic packaging.
Microelectronic packaging -- Congresses.
Microelectronic packaging.
Manufacturing processes -- Congresses.
Manufacturing processes.
Genre/Form
Electronic books.
Conference papers and proceedings.
Conference papers and proceedings.
Added Author
Wu, Yanwen, editor.
Added Title
ICCPMT 2010
Other Form:
Print version: 9780878492138 0878492135 (DLC) 2011414054 (OCoLC)722384684
ISBN
9783038134800 (electronic book)
3038134805 (electronic book)
9780878492138
0878492135