| Description |
1 online resource |
| Physical Medium |
polychrome |
| Description |
text file |
| Contents |
Volume 1; Contents; Foreword to the Encyclopedia of Thermal Packaging; Dedication; Chapter 1. A Review of Cooling Road Maps for 3D Chip Packages; 1.1. Introduction; 1.2. TSV Fabrication; 1.3. Thermal-Mechanical-Electrical Challenges in 3-D; Acknowledgement; References; Chapter 2. Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks; 2.1. Introduction; 2.2. Passive Immersion Cooling; 2.2.1. Single Phase Natural Convection; 2.2.2. Pool Boiling; 2.3. Pumped Liquid Systems; 2.3.1. Single Phase Forced Convection; 2.3.2. Flow Boiling; 2.4. Performance Maps; 2.5. Conclusions |
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2.6. NomenclatureReferences; Chapter 3. Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency; 3.1. Introduction; 3.1.1. Thermal Issues in Modern Computer Chips; 3.1.2. Dynamic Thermal Management; 3.1.3. Temperature-leakage Interdependency; 3.1.4. Motivation of DTM Considering Temperature-leakage Interdependency; 3.2. RC Thermal Model Considering Leakage; 3.2.1. Single Core RC Thermal Model; 3.2.2. Leakage and Temperature Dependency; 3.2.3. Thermal Model with Leakage Power; 3.2.3.1. Case 1; 3.2.3.2. Case 2; 3.2.3.3. Case 3 |
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3.3. Thermal Aware Speed and Task Scheduling3.3.1. Problem Formulation; 3.3.2. Dynamic Programming with Fixed Task Order; 3.3.3. Considering Task Rescheduling; 3.3.3.1. Dynamic Programming with Task Scheduling; 3.3.3.2. Heuristic to Improve the Computation Speed; 3.4. Simulated Test Case; 3.4.1. Comparison 1: With Existing Leakage-temperature Models; 3.4.2. Comparison 2: Fixed Order, Full Rescheduling and Grouping; 3.5. Conclusion and Future Work; 3.5.1. Conclusion; 3.5.2. Future Work; Nomenclature; Acknowledgments; References |
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Chapter 4. Energy Reduction and Performance Maximization Through Improved Cooling4.1. Introduction; 4.2. Leakage Current Effects; 4.3. Improved Cooling; 4.4. Performance Modeling; 4.5. Reliability Concerns; 4.6. Frequency Improvements; 4.7. System Performance; 4.8. Total Cost of Ownership; 4.9. Conclusions; Nomenclature for Figure Legends; Nomenclature for Equations; Acknowledgments; References; Chapter 5. Optimal Choice of Heat Sinks from an Industrial Point of View; 5.1. Introduction; 5.2. Heat Sink Basics; 5.2.1. The Murray-Gardner Assumptions; 5.2.2. Heat Spreading; 5.2.3. Radiation |
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5.3. Heat Sink Modeling Approaches from a Designer's Perspective5.3.1. Approaches not Recommended; 5.3.1.1. Vendor Data; 5.3.1.2. Convective Resistance Models; 5.3.1.3. Two-resistance Model; 5.3.1.4. Empirical Correlations; 5.3.2. Approaches to Acquire Insight in the Basic Physics; 5.3.2.1. Heat Exchanger Model; 5.3.3. Approaches to Acquire Insight in Optimization Parameters; 5.3.3.1. Literature Study; 5.3.3.2. Semi-analytical Correlations; 5.3.3.3. Constructal Theory; 5.3.3.4. Web-based Tools; 5.3.3.5. Dedicated Heat Sink Software; 5.3.4. Approaches to Acquire Insight in Fluid Dynamics |
| Local Note |
eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America |
| Subject |
Electronic packaging.
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Electronic packaging. |
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Insulation (Heat)
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Insulation (Heat) |
| Genre/Form |
Electronic books.
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Electronic books.
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| Added Author |
Bar-Cohen, Avram, 1946- editor.
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| Other Form: |
Print version: Encyclopedia of thermal packaging. Set 2, Thermal packaging tools 9789814327602 (OCoLC)863174530 |
| ISBN |
9789814327664 electronic book |
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9814327662 electronic book |
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9789814327602 |
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9814327603 |
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