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Bestseller
Title
Lead-free solder interconnect reliability / edited by Dongkai Shangguan.
Publication Info.
Materials Park, OH : ASM International, 2005.
Online access
Online eBook. Access restricted to current Rider University students, faculty, and staff.
Instructions for reading/downloading this eBook
Item Status
Description
1 online resource (x, 292 pages) : illustrations
Physical Medium
polychrome
Description
text file
Bibliography
Includes bibliographical references and index.
Local Note
eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America
Subject
Microelectronic packaging -- Reliability.
Microelectronic packaging -- Reliability.
Microelectronic packaging.
Solder and soldering.
Solder and soldering.
Lead-free electronics manufacturing processes.
Lead-free electronics manufacturing processes.
Genre/Form
Electronic books.
Electronic books.
Added Author
Shangguan, Dongkai, 1963-
Other Form:
Print version: Lead-free solder interconnect reliability. Materials Park, OH : ASM International, 2005 0871708167 (DLC) 2005050106 (OCoLC)60543308
ISBN
9781615030934 (electronic book)
161503093X (electronic book)
9780871708168
0871708167