| Description |
1 online resource (633 pages) : color illustrations, charts, photographs, graphs, tables |
| Physical Medium |
polychrome |
| Description |
text file |
| Bibliography |
Includes bibliographical references at the end of each chapters and index. |
| Contents |
""Title Page""; ""Copyright""; ""Board of Directors""; ""Organizing Committee""; ""Symposium Committee""; ""User Groups""; ""Contents""; ""2013 IPFA Best Paper""; ""Non-Destructive Open Fault Isolation in Flip-Chip Devices with Space-Domain Reflectometry""; ""3D Packages""; ""3D Void Imaging in Through Silicon Vias by X-ray Nanotomography in a SEM""; ""Challenges for Physical Failure Analysis of 3D-Integrated Devices -- Sample Preparation and Analysis to Support Process Development of TSVs""; ""Sample Preparation Strategies for Fast and Effective Failure Analysis of 3D Devices"" |
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""Fast and Precise 3D Tomography of TSV by Using Xe Plasma FIB""""Case Studies and the Failure Analysis Process""; ""22 nm BEOL TDDB Defect Localization and Root Cause Analysis""; ""Open Failure Diagnosis Candidate Selection Based on Passive Voltage Contrast Potential and Processing Cost""; ""Effective Defect Localization on Nanoscale Short Failures""; ""Defect Isolation Tools Accelerate the Failure Analysis Process""; ""First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures"" |
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""The Application of Magnetic Force Microscopy for Detection of Subsurface Anomalies in Semiconductor Device Wiring Levels""""Computed Tomography as Failure Analysis Insurance""; ""Challenges of Small Defect Analysis in Large Analog Power FET Arrays""; ""Conversion of a D-Mode FET to an E-Mode FET via Electrostatic Discharge in a GaAs Power Amplifier Duplexer Module""; ""Marginal RF Gain Investigation and Root Cause Determination""; ""Anamnesis in Failure Analysis -- How a System-Related Approach Can Save Failure Analysis (FA) Time, Shorten Learning Loops and Reduce Cost"" |
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""Failure Analysis for SRAM Logic Type Failures""""Circuit Edit ""; ""Circuit Edit Geometric Trends""; ""Implications of Helium and Neon Ion Beam Chemistry for Advanced Circuit Editing""; ""Silicon and Package Preparation Options for Focused Ion Beam (FIB) Circuit Editing and General Packaging Failure Analysis""; ""Defect Characterization and Metrology ""; ""Simulation Studies on Fluorine Spec Limit for Process Monitoring of Microchip Al Bondpads in Wafer Fabrication""; ""Surface Microstructure Evolution Upon Silicidation of Ni(Pt) and the Different Responses to Metal Etch"" |
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""Gate Leakage Characterization and Fail Mode Analysis on 20 nm Technology Parametric Test Structures""""STEM EDX Mappings and Tomography for Process Characterization and Physical Failure Analysis of Advanced Devices""; ""Automatic Registering and Stitching of TEM/STEM Image Mosaics""; ""AFM-Based Chemical and Mechanical Property Characterization of Interconnects and Defects""; ""Evaluation of Digital Holography Microscopy for Roughness Control Prior Wafer Direct Bonding""; ""Emerging Concepts and Techniques ""; ""Pump-Probe Imaging of Integrated Circuits"" |
| Local Note |
eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America |
| Subject |
Electronics -- Materials -- Testing -- Congresses.
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Electronics -- Materials -- Testing. |
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Electronics -- Materials. |
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Electronic apparatus and appliances -- Testing -- Congresses.
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Electronic apparatus and appliances -- Testing -- Congresses. |
| Genre/Form |
Electronic books.
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Conference papers and proceedings.
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Conference papers and proceedings.
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| Added Author |
Electronic Device Failure Analysis Society, sponsor.
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| Other Form: |
Print version: International Symposium for Testing and Failure Analysis (39th : 2013 : San Jose, California). ISTFA 2013 : conference proceedings from the 39th International Symposium for Testing and Failure Analysis, November 3-7, 2013, San Jose Convention Center, San Jose, California, USA. Materials Park, Ohio : ASM International, ©2013 xix, 613 pages 9781627080224 |
| ISBN |
9781627080231 (electronic book) |
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1627080236 (electronic book) |
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9781680155136 (electronic book) |
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168015513X (electronic book) |
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9781627080224 |
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