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Conference International Symposium for Testing and Failure Analysis (23rd : 1997 : Santa Clara, Calif.)

Title ISTFA '97 : proceedings of the 23rd International Symposium for Testing and Failure Analysis : 27-31 October, 1997, Santa Clara Convention center, Santa Clara, California / sponsored by ASM International.

Publication Info. Materials Park, OH : ASM International, [1997]
©1997
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Online eBook. Access restricted to current Rider University students, faculty, and staff.
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Description 1 online resource (xix, 346 pages) : illustrations
Physical Medium polychrome
Description text file
Note "Manager of Book Production Grace M. Davidson."
Bibliography Includes bibliographical references and index.
Contents ""Preface""; ""Table of Contents""; ""24th International Symposium for Testing and Failure Analysis""; ""25th International Symposium for Testing and Failure Analysis""; ""24th International Symposium for Testing and Failure Analysis • ISTFA ' 98""; ""Experimental Figures for the Defect Coverage of looaVectors""; ""A CAD- Based Approach to Failure Diagnosis of CMOSLSI with Single Fault Using Abnormal IOOQ ""; ""Test and Failure Analysis Implications of a Novel Inter-Bit Dependency in a Non- Volatile Memory""; ""Analysis of a Latent Deep Submicron CMOS Device Isolation Leakage Mechanism""
""Scanning Fluorescent Microthermal Imaging""""Temperature Profiling with Highest Spatial and Temperature Resolution by Means of Scanning Thermal Microscopy (SThM)""; ""Thermal and Optical Enhancements to Liquid Crystal Hot Spot Detection Methods""; ""Application of Ba~kside Photo and Thermal Emission Microscopy Techniques to Advanced Memory Devices""; ""Cross Sectioning with a Pivoting Sample Block""; ""Gain Reduction in Silicon Phototransistors Induced by Metallization Mask Misalignment""; ""Comparison Precision XTEM Specimen Preparation Techniques for Semiconductor Failure Analysis""
""Temperature-Dependent Electronic Circuit Analogy for Predicting Wire Temperature as a Function of Current""""The Application of FIB Voltage-Contrast Technique Combining with TEM on Subtle Defect Analysis: Via Delamination After TC""; ""The Usage of Focused Ion Beam Induced Deposition of Gold Film in Ie Device Modification and Repair""; ""Failure Analysis Challenges of Surface Micromachined Accelerometers""; ""Failure Analysis for Micro-Electrical- Mechanical Systems (MEMS)""
""Investigation of Multi- Level Metallization ULSls by Light Emission from the Back- Side and Front- Side of the Chip""""A Simple, Cost Effective, and Very Sensitive Alternative for Photon Emission Spectroscopy""; ""Novel Failure Analysis Technique "" Light Induced State Transition (LIST)"" Method Using an OBIC System""; ""An Application of Breakthrough Failure Analysis Techniques in Eliminating Silicon Dislocation Problem in Sub-Micron CMOS Devices""; ""Characterization of Californium -- 252 (2s2Cf) as a Laboratory Source of Radiation for Testing and Analysis of Semiconductor Devices""
""Dendritic Growth Failure of a Mesa Diode""""Interpretation of Sudden Failures in Pump Laser Diodes""; ""Through- Transmission Acoustic Inspection of Ball Grid Array (BGA) Packages""; ""Moisture Detection Method in Ceramic Package by Slight Current Measurement""; ""Laser Microchemical Technology: NewTools for Flip- Chip Debug and Failure Analysis""; ""Single Contact Electron Beam Induced Current Microscopy for Failure Analysis of Integrated Circuits""; ""Electrical and Chemical Characterization of FIB- Deposited Insulators""
Local Note eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America
Subject Electronics -- Materials -- Testing -- Congresses.
Electronics -- Materials -- Testing.
Electronics -- Materials.
Electronic apparatus and appliances -- Testing -- Congresses.
Electronic apparatus and appliances -- Testing -- Congresses.
Genre/Form Electronic books.
Conference papers and proceedings.
Conference papers and proceedings.
Added Author Davidson, Grace M.
ASM International.
Added Title 23rd international symposium for testing and failure analysis
Other Form: Print version: Davison, Grace M. ISTFA '97 : Proceedings of the 23rd International Symposium for Testing and Failure Analysis. Materials Park : A S M International, ©1997 9780871706195
ISBN 9781615030828 (electronic book)
1615030824 (electronic book)
9780871706195 (electronic book)
0871706199 (electronic book)

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