| Description |
1 online resource (xix, 456 pages) : illustrations |
| Physical Medium |
polychrome |
| Description |
text file |
| Note |
Some online versions lack accompanying media packaged with the printed version. |
| Bibliography |
Includes bibliographical references and index. |
| Contents |
""Title Page""; ""Copyright""; ""Contents""; ""IPFA 2011 Best Paper""; ""Electrical Failure and Damage Analysis of Multi-layer Metal Films on Flexible Substrate during Cyclic Bending Deformation""; ""Session 1: Emerging FA Techniques and Concepts""; ""A Position-Sensitive, Single-Photon Detector with Enhanced NIR Response""; ""Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave Probing""; ""Thermal Frequency Imaging: A new application of Laser Voltage Imaging applied on 40nm technology"" |
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""Local Lattice Strain Measurement using Geometric Phase Analysis of Dark Field Images from Scanning Transmission Electron Microscopy""""Correcting for spherical aberrations in solid immersion microscopy using a deformable mirror""; ""Session 2: Circuit Edit""; ""The Challenges of Backside Focused Ion Beam (FIB) Editing in the Presence of Deep Trench Decoupling Capacitors""; ""State of the Art Substrate Manipulation As a Tool for Enhancing Product Performance""; ""Neon Ion Microscope Nanomachining Considerations"" |
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""Instant Solid Immersion Lens creation in silicon with a Focused Ion Beam- comparing refractive and diffractive methods""""Circuit Edit and Optical Probe Development and Validation for Next Generation Process Nodes""; ""Session 3: Packaging and Assembly Level FA I""; ""3DIC Fault Isolation Using the OBIRCH Approach""; ""Improving Wire Sweep Performance by Measuring Degree of Cure of Epoxy Mold Compounds""; ""Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology"" |
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""Quantitative Phase Shift Analysis for 3D Defect Localization Using Lock-in Thermography""""Failure Analysis of Flip Chip C4 Package Using Focused Ion Beam Milling Technique""; ""Session 4: Test and Diagnostics""; ""Layout-aware Diagnosis Leads to Efficient and Effective Physical Failure Analysis""; ""Device Selection for Failure Analysis of Chain Fails Using Diagnosis Driven Yield Analysis""; ""Debugging an Invisible Flaky Scan Chain Defect""; ""Diagnose Compound Hold Time Faults Caused by Spot Delay Defects at Clock Tree""; ""Session 5: Defect Characterization and Metrology"" |
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""A Comprehensive Analysis Methodology for Gate Oxide Integrity Failure Using Combined FA Techniques""""Al Bondpads, Halogens, and an ESCA-based Search for the Invisible Cause of Poor Throughput at Wafer Probe""; ""Whisker Formation in Copper Electroplating""; ""Comprehensive nano-structural approach of SSRM nanocontact on siliconthrough TEM-STEM study""; ""Highly Automated Transmission Electron Microscopy Tomography for Defect Understanding""; ""Transmission Electron Microscopy Characterization of FinFET � Understanding the 3D Structure by 2D Imaging Technique"" |
| Local Note |
eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America |
| Subject |
Electronics -- Materials -- Testing -- Congresses.
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Electronics -- Materials -- Testing. |
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Electronics -- Materials. |
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Electronic apparatus and appliances -- Testing -- Congresses.
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Electronic apparatus and appliances -- Testing -- Congresses. |
| Indexed Term |
Testing analysis |
| Genre/Form |
Electronic books.
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Conference papers and proceedings.
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Electronic books.
|
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Conference papers and proceedings.
|
| Added Author |
Electronic Device Failure Analysis Society.
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International Symposium for Testing and Failure Analysis (37th : 2011 : San Jose, Calif.)
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ASM International.
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| Added Title |
International Symposium for Testing and Failure Analysis 2011 |
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Conference proceedings of the 37th International Symposium for Testing and Failure Analysis |
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37th International Symposium for Testing and Failure Analysis |
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Thirty-seventh International Symposium for Testing and Failure Analysis |
| Other Form: |
Print version: International Symposium for Testing and Failure Analysis (37th : 2011 : San Jose, Calif.). ISTFA 2011. Materials Park, OH : ASM International, 2011 9781615038268 (OCoLC)769470020 |
| ISBN |
9781615038503 (electronic book) |
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1615038507 (electronic book) |
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9781680155112 (electronic book) |
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1680155113 (electronic book) |
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9781615038268 |
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1615038264 |
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0615038264 (paperback) |
