LEADER 00000cam a2200817Ka 4500 001 ocn771901447 003 OCoLC 005 20160527041204.9 006 m o d 007 cr cnu---unuuu 008 120109s2011 ohua obf 001 0 eng d 019 787848225 020 9781613447598|q(electronic book) 020 1613447590|q(electronic book) 020 9781615037261|q(electronic book) 020 1615037268|q(electronic book) 020 9781615037261|q(e-book) 020 |z161503725X 020 |z9781615037254 035 (OCoLC)771901447|z(OCoLC)787848225 040 N$T|beng|epn|cN$T|dVLB|dE7B|dN$T|dGZM|dCOO|dZCU|dDEBSZ |dB24X7|dOCLCQ|dKNOVL|dYDXCP|dKNOVL|dOCLCQ|dKNOVL|dOCLCQ 049 RIDW 050 4 TK7871|b.M52 2011eb 072 7 TEC|x008060|2bisacsh 072 7 TEC|x008070|2bisacsh 082 04 621.381|223 090 TK7871|b.M52 2011eb 245 00 Microelectronics failure analysis :|bdesk reference / |cedited by Richard J. Ross ; EDFAS, ASM International. 246 3 Microelectronics failure analysis desk reference 250 6th ed. 264 1 Materials Park, Ohio :|bASM International,|c[2011] 264 4 |c©2011 300 1 online resource (xi, 660 pages) :|billustrations 336 text|btxt|2rdacontent 337 computer|bc|2rdamedia 338 online resource|bcr|2rdacarrier 340 |gpolychrome|2rdacc 347 text file|2rdaft 500 "ASM International, 2011, no. 09110Z"--Page 4 of cover. 500 Some online versions lack accompanying media packaged with the printed version. 504 Includes bibliographical references and indexes. 505 0 Section 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information. 588 0 Print version record. 590 eBooks on EBSCOhost|bEBSCO eBook Subscription Academic Collection - North America 650 0 Microelectronics|0https://id.loc.gov/authorities/subjects/ sh85084822|xMaterials|0https://id.loc.gov/authorities/ subjects/sh2002006405|xTesting|0https://id.loc.gov/ authorities/subjects/sh99005648|vHandbooks, manuals, etc. |0https://id.loc.gov/authorities/subjects/sh99001300 650 0 Microelectronics|0https://id.loc.gov/authorities/subjects/ sh85084822|xDefects|0https://id.loc.gov/authorities/ subjects/sh99005477|xTesting|0https://id.loc.gov/ authorities/subjects/sh99005648|vHandbooks, manuals, etc. |0https://id.loc.gov/authorities/subjects/sh99001300 650 0 Electronic apparatus and appliances|xTesting|0https:// id.loc.gov/authorities/subjects/sh85042269|vHandbooks, manuals, etc.|0https://id.loc.gov/authorities/subjects/ sh99001300 650 0 Electronics|xMaterials|0https://id.loc.gov/authorities/ subjects/sh85042388|xTesting|0https://id.loc.gov/ authorities/subjects/sh99005648|vHandbooks, manuals, etc. |0https://id.loc.gov/authorities/subjects/sh99001300 650 0 Electronics|xMaterials|0https://id.loc.gov/authorities/ subjects/sh85042388|xDefects|0https://id.loc.gov/ authorities/subjects/sh99005477|vHandbooks, manuals, etc. |0https://id.loc.gov/authorities/subjects/sh99001300 650 7 Microelectronics|xMaterials|xTesting.|2fast|0https:// id.worldcat.org/fast/1019774 650 7 Microelectronics.|2fast|0https://id.worldcat.org/fast/ 1019757 650 7 Testing.|2fast|0https://id.worldcat.org/fast/1148240 650 7 Electronic apparatus and appliances|xTesting.|2fast|0https ://id.worldcat.org/fast/906837 650 7 Electronics|xMaterials|xTesting.|2fast|0https:// id.worldcat.org/fast/907571 650 7 Electronics|xMaterials.|2fast|0https://id.worldcat.org/ fast/907562 650 7 Electronics|xMaterials|xDefects.|2fast|0https:// id.worldcat.org/fast/907564 655 0 Electronic books. 655 4 Electronic books. 655 7 Handbooks and manuals.|2fast|0https://id.worldcat.org/fast /1423877 655 7 Handbooks and manuals.|2lcgft|0https://id.loc.gov/ authorities/genreForms/gf2014026109 700 1 Ross, Richard J.|0https://id.loc.gov/authorities/names/ n00003843 710 2 ASM International.|0https://id.loc.gov/authorities/names/ n86066562 710 2 Electronic Device Failure Analysis Society.|0https:// id.loc.gov/authorities/names/no99092286 776 08 |iPrint version:|tMicroelectronics failure analysis.|b6th ed.|dMaterials Park, Ohio : ASM International, ©2011 |z161503725X|w(OCoLC)701026679 856 40 |uhttps://rider.idm.oclc.org/login?url=http:// search.ebscohost.com/login.aspx?direct=true&scope=site& db=nlebk&AN=395927|zOnline eBook. Access restricted to current Rider University students, faculty, and staff. 856 42 |3Instructions for reading/downloading this eBook|uhttp:// guides.rider.edu/ebooks/ebsco 901 MARCIVE 20231220 948 |d20160607|cEBSCO|tebscoebooksacademic|lridw 994 92|bRID