Skip to content
You are not logged in |Login  
Limit search to available items
Record:   Prev Next
More Information
Author Ogrenci-Memik, Seda, author.

Title Heat management in integrated circuits : on-chip and system-level monitoring and cooling / Seda Ogrenci-Memik.

Publication Info. London, United Kingdom : The Institution of Engineering and Technology, 2015.

Item Status

Description 1 online resource (ix, 253 pages) : illustrations
Series Materials, circuits and devices series ; 28
Materials, circuits and devices series ; 28.
Bibliography Includes bibliographical references and index.
Contents Heat in integrated circuits and systems -- On-chip temperature sensing -- Dynamic thermal management -- Active cooling -- Mitigating thermal events at the system level and above -- Emerging directions in thermal-aware systems.
Summary "As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins, creating sub-optimal results. At a larger scale, cooling is the second most costly item in the electricity bills of well-designed high-performance computing and data centers, costing 30-50% of the total. Thermal monitoring and management in integrated circuits is therefore becoming increasingly important. This book covers thermal monitoring and management in integrated circuits, with a focus on devices and materials that are intimately integrated on-chip as opposed to in-package or on-board. The devices and circuits discussed include various designs used for the purpose of converting temperature to a digital measurement and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. Topics covered include an overview of heat in integrated circuits and systems, on-chip temperature sensing, dynamic thermal management, active cooling, and mitigating thermal events at the system-level and above"--Provided by publisher.
Local Note eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America
Subject Integrated circuits -- Design and construction.
Electronic circuits -- Temperature compensation.
Temperature measuring instruments.
Temperature control.
Genre/Form Electronic books.
Other Form: Print version: Ogrenci-Memik, Seda. Heat management in integrated circuits. London, United Kingdom : The Institution of Engineering and Technology, 2015 9781849199346 (OCoLC)935526988
ISBN 9781849199353 (ePDF)
1849199353 (ePDF)
9781849199346 (hardback)
1849199345 (hardback)