LEADER 00000cam a2200673Ma 4500 001 ocn785777958 003 OCoLC 005 20160910032342.6 006 m o d 007 cr cn||||||||| 008 120227s2011 si a ob 001 0 eng d 016 7 015880451|2Uk 019 779937767|a858228012|a903928741 020 9789812813992|q(electronic book) 020 9812813993|q(electronic book) 020 |z9812568638 020 |z9789812568632 035 (OCoLC)785777958|z(OCoLC)779937767|z(OCoLC)858228012 |z(OCoLC)903928741 040 E7B|beng|epn|cE7B|dOCLCQ|dCIT|dOCLCQ|dUKMGB|dUIU|dDEBSZ |dOCLCO|dYDXCP|dOCLCQ|dN$T|dIDEBK|dOCLCF|dBWS|dEBLCP |dOCLCQ 049 RIDW 050 4 TK7871.95|b.L58 2011eb 072 7 TEC|x008110|2bisacsh 082 04 621.3815284015118|223 090 TK7871.95|b.L58 2011eb 100 1 Liu, Weidong,|d1965-|0https://id.loc.gov/authorities/names /no2001051964 245 10 BSIM4 and MOSFET modeling for IC simulation /|cWeidong Liu, Chenming Hu. 264 1 Singapore :|bWorld Scientific Pub. Co.,|c2011. 300 1 online resource (xix, 414 pages) :|billustrations. 336 text|btxt|2rdacontent 337 computer|bc|2rdamedia 338 online resource|bcr|2rdacarrier 340 |gpolychrome|2rdacc 347 text file|2rdaft 490 1 International series on advances in solid state electronics and technology 504 Includes bibliographical references and index. 505 0 Forword; Dedication; Preface; Contents; Chapter 1 BSIM and IC Simulation; 1.1 Circuit Simulation and Compact Models; 1.2 BSIM -- The Beginning; 1.3 BSIM3 -- A Compact Model Based on New MOSFET Physics; 1.4 BSIM3v3 -- World's First MOSFET Standard Model; 1.5 BSIM4 -- Aimed for 130nm Down to 20nm Nodes; 1.6 BSIM SOI; 1.7 Impact of BSIM; 1.8 Looking Towards the Future -- The Multi-Gate MOSFET Model; 1.9 The Intent of This Book; References; Chapter 2 Fundamental MOSFET Physical Effects and Their Models for BSIM4; 2.1 Introduction and Chapter Objectives; 2.2 Gate and Channel Geometries and Materials. 505 8 2.2.1 Gate and Channel Lengths and Widths2.2.2 Model Card and Parameter Binning; 2.2.3 Gate Stack and Substrate Material Model Options; 2.3 Temperature-Dependence Model Options; 2.4 Threshold Voltage; 2.4.1 Long Channel with Uniform Substrate Doping; 2.4.2 Short-Channel Effect: Vth Roll-Off and Drain Bias Effects; 2.4.3 Narrow-Width Effects; 2.4.4 Non-Uniform Substrate Doping; 2.4.4.1 Non- Uniform Vertical Doping; 2.4.4.2 Non-Uniform Lateral Doping: Pocket Implants; 2.4.5 Vth Temperature Dependence; 2.4.6 BSIM4 Vth Equation; 2.5 Poly-Silicon Gate Depletion; 2.6 Bulk-Charge Effects. 505 8 2.7 LDD Resistances2.8 Finite Charge Thickness; 2.9 Effective Mobility; 2.10 Layout-Dependent Effects: Mechanical Stress and Proximity Effects; 2.11 Chapter Summary; 2.12 Parameter Table; References; Chapter 3 Channel DC Current and Output Resistance; 3.1 Introduction and Chapter Objectives; 3.2 Channel Current Theory; 3.3 Single Continuous Channel Charge Model; 3.4 Channel Current in Subthreshold and Linear Operations; 3.5 Velocity Saturation and Velocity Overshoot; 3.6 Output Resistance in Saturation Region; 3.6.1 CLM: Channel Length Modulation; 3.6.2 DIBL: Drain-Induced Barrier Lowering. 505 8 3.6.3 DITS: Drain-Induced Threshold Voltage Shift Due to Non-Uniform Doping3.6.4 SCBE: Substrate Current Induced Body-Bias Effect; 3.6.5 Channel Current Model for All Regions of Operation; 3.7 Source-End Velocity Limit; 3.8 Chapter Summary; 3.9 Parameter Table; References; Chapter 4 Gate Direct-Tunneling and Body Currents; 4.1 Introduction and Chapter Objectives; 4.2 Gate Direct- Tunneling Current Theory and Model; 4.2.1 Tunneling Mechanisms and Current Components; 4.2.2 Gate Oxide Voltage; 4.2.3 Gate-Body Tunneling Current Igb; 4.2.4 Gate -Source/Drain Tunneling Through Overlap Regions. 505 8 4.2.5 Gate-Channel Tunneling Current4.2.5.1 Igc0: The Vds = 0 Bias Scenario; 4.2.5.2 Igcs and Igcd Partitioning: The Non-Zero Vds Scenario; 4.2.6 Characterization and Parameter Extraction; 4.3 Body Currents; 4.3.1 Impact Ionization; 4.3.2 Gate-Induced Source and Drain Leakage; 4.4 Summary of BSIM4 Branch and Terminal DC Currents; 4.5 Chapter Summary; 4.6 Parameter Table; References; Chapter 5 Charge and Capacitance Models; 5.1 Introduction and Chapter Objectives; 5.2 MOSFET Capacitance Theory; 5.3 Intrinsic Charge and Capacitance Models; 5.3.1 Charge- Thickness Model (CTM). 520 This book presents the art of advanced MOSFET modeling for integrated circuit simulation and design. It provides the essential mathematical and physical analyses of all the electrical, mechanical and thermal effects in MOS transistors relevant to the operation of integrated circuits. Particular emphasis is placed on how the BSIM model evolved into the first ever industry standard SPICE MOSFET model for circuit simulation and CMOS technology development. The discussion covers the theory and methodology of how a MOSFET model, or semiconductor device models in general, can be implemented to be ro. 590 eBooks on EBSCOhost|bEBSCO eBook Subscription Academic Collection - North America 650 0 Metal oxide semiconductor field-effect transistors|0https: //id.loc.gov/authorities/subjects/sh85084065|xComputer simulation.|0https://id.loc.gov/authorities/subjects/ sh99005300 650 0 Electronic circuit design|xData processing.|0https:// id.loc.gov/authorities/subjects/sh85042278 650 7 Metal oxide semiconductor field-effect transistors |xComputer simulation.|2fast|0https://id.worldcat.org/fast /1017615 650 7 Metal oxide semiconductor field-effect transistors.|2fast |0https://id.worldcat.org/fast/1017614 650 7 Electronic circuit design|xData processing.|2fast|0https:/ /id.worldcat.org/fast/906866 655 4 Electronic books. 700 1 Hu, Chenming.|0https://id.loc.gov/authorities/names/ n83055893 776 08 |iPrint version:|aLiu, Weidong, 1965-|tBSIM4 and MOSFET modeling for IC simulation.|dSingapore ; London : World Scientific, 2011 830 0 International series on advances in solid state electronics and technology.|0https://id.loc.gov/ authorities/names/no95055036 856 40 |uhttps://rider.idm.oclc.org/login?url=http:// search.ebscohost.com/login.aspx?direct=true&scope=site& db=nlebk&AN=514852|zOnline eBook. Access restricted to current Rider University students, faculty, and staff. 856 42 |3Instructions for reading/downloading this eBook|uhttp:// guides.rider.edu/ebooks/ebsco 901 MARCIVE 20231220 948 |d20161017|cEBSCO|tebscoebooksacademic updated AugtoOct17 |lridw 948 |d20160607|cEBSCO|tebscoebooksacademic|lridw 994 92|bRID