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Corporate Author National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.

Title Materials for high-density electronic packaging and interconnection.

Publication Info. Washington, D.C. : National Academy Press, 1990.

Item Status

Description 1 online resource (xiv, 139 pages) : illustrations
Physical Medium polychrome
Description text file
Note Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Available from Defense Technical Information Center, Cameron Station.
"NMAB-449."
Bibliography Includes bibliographical references.
Local Note eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America
Subject Electronic packaging -- Materials.
Electronic packaging -- Materials.
Electronic packaging.
Genre/Form Electronic books.
Other Form: Print version: National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging. Materials for high-density electronic packaging and interconnection. Washington, D.C. : National Academy Press, 1990 030904233X (DLC) 90060385 (OCoLC)21437247
ISBN 0585143951 (electronic book)
9780585143958 (electronic book)
030904233X
9780309042338