Title Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan / edited by Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir.

Publication Info.	Zurich Trans Tech Publications Ltd [2018]
	©2018

Online access
Online eBook via EBSCO. Access restricted to current Rider University students, faculty, and staff.
Instructions for reading/downloading the EBSCO version of this eBook

Item Status

Description	1 online resource.
Physical Medium	polychrome
Description	text file
Series	Solid state phenomena ; volume 273
	Diffusion and defect data. Pt. B, Solid state phenomena ; volume 273.
Local Note	eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America
Subject	Electronic packaging -- Congresses.
	Electronic packaging.
	Electronic packaging -- Materials -- Congresses.
	Electronic packaging -- Materials.
Genre/Form	Electronic books.
	Conference papers and proceedings.
	Conference papers and proceedings.
Added Author	Nogita, Kazuhiro, editor.
	Mohd Arif Anuar Mohd Salleh, editor.
	Mohd Mustafa Al Bakri Abdullah, editor.
	Liyana Jamaludin, editor.
	Muhammad Faheem Mohd Tahir, editor.
ISBN	9783035733242 (electronic book)
	3035733244 (electronic book)
	9783035713244