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Subjects (1-2 of 2)
Microelectronic packaging -- Congresses.
1
Bestseller
Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013
International Conference on Packaging and Manufacturing Technology (3rd : 2013 : Brisbane Australia)
[Zurich], Switzerland : Trans Tech Publications, [2014]
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2
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Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 Interna
International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China)
Stafa-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, [2011]
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