| Description |
1 online resource (119 pages) : illustrations. |
| Physical Medium |
polychrome |
| Description |
text file |
| Series |
Advanced Materials Research,
1662-8985 ;
Volume 1038
|
|
Advanced materials research ; v. 1038.
|
| Bibliography |
Includes bibliographical references at the end of each chapters and index. |
| Summary |
Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science. |
| Local Note |
eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America |
| Subject |
Molded interconnect devices.
|
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Molded interconnect devices. |
|
Three-dimensional display systems -- Congresses.
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Three-dimensional display systems. |
| Genre/Form |
Electronic books.
|
|
Conference papers and proceedings.
|
|
Conference papers and proceedings.
|
| Added Author |
Franke, Jörg, editor.
|
| Other Form: |
Print version: International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany). 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. Pfaffikon, Switzerland : TTP, ©2014 124 pages Advanced materials research ; Volume 1038 1662-8985 9783038352525 |
| ISBN |
9783038266365 (electronic book) |
|
3038266361 (electronic book) |
|
9783038352525 |
|
