Title Lead-free solder interconnect reliability / edited by Dongkai Shangguan.

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Description	1 online resource (x, 292 pages) : illustrations
Physical Medium	polychrome
Description	text file
Bibliography	Includes bibliographical references and index.
Local Note	eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America
Subject	Microelectronic packaging -- Reliability.
	Microelectronic packaging -- Reliability.
	Microelectronic packaging.
	Solder and soldering.
	Solder and soldering.
	Lead-free electronics manufacturing processes.
	Lead-free electronics manufacturing processes.
Genre/Form	Electronic books.
	Electronic books.
Added Author	Shangguan, Dongkai, 1963-
Other Form:	Print version: Lead-free solder interconnect reliability. Materials Park, OH : ASM International, 2005 0871708167 (DLC) 2005050106 (OCoLC)60543308
ISBN	9781615030934 (electronic book)
	161503093X (electronic book)
	9780871708168
	0871708167