| Description |
1 online resource (xx, 528 pages) : illustrations. |
| Physical Medium |
polychrome |
| Description |
text file |
| Series |
Artech House integrated microsystems series
|
|
Artech House integrated microsystems series.
|
| Bibliography |
Includes bibliographical references and index. |
| Contents |
Integrated Interconnect Technologies for 3D Nanoelectronic Systems; Contents; Foreword; Preface; Chapter 1: Revolutionary Silicon AncillaryTechnologies for the Next Era of Gigascale Integration; Chapter 2: Chip-Package Interaction and Reliability Impact on Cu/Low-k Interconnects; Chapter 3: Mechanically Compliant I/O Interconnects and Packaging; Chapter 4: Power Delivery to Silicon; Chapter 5: On-Chip Power Supply Noise Modeling for Gigascale 2D and 3D Systems; Chapter 6: Off-Chip Signaling; Chapter 7: Optical Interconnects for Chip-to-Chip Signaling. |
| Summary |
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. |
| Local Note |
eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America |
| Subject |
Interconnects (Integrated circuit technology)
|
|
Interconnects (Integrated circuit technology) |
|
Telecommunication systems.
|
|
Telecommunication systems. |
|
Nanoelectronics.
|
|
Nanoelectronics. |
| Genre/Form |
Electronic books.
|
|
Electronic books.
|
| Added Author |
Bakir, Muhannad S.
|
|
Meindl, James D., 1933-2020.
|
| Other Form: |
Print version: Integrated interconnect technologies for 3D nanoelectronic systems. Boston, Mass. ; London : Artech House, ©2009 9781596932463 1596932465 (OCoLC)302063121 |
| ISBN |
9781596932470 (electronic book) |
|
1596932473 (electronic book) |
|
1596932465 |
|
9781596932463 |
|
