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Bestseller
Title
Microelectronics failure analysis : desk reference / edited by the Electronic Device Failure Analysis Society, Desk Reference Committee.
Publication Info.
Materials Park, Ohio : ASM International, [2004]
©2004
Online access
Online eBook. Access restricted to current Rider University students, faculty, and staff.
Instructions for reading/downloading this eBook
Item Status
Description
1 online resource (xiv, 800 pages) : illustrations
Physical Medium
polychrome
Description
text file
Bibliography
Includes bibliographical references and indexes.
Contents
Introduction -- Failure analysis process flow -- Failure verification -- Failure mode: failure classifications -- Special devices -- Non-destructive analysis techniques -- Depackaging -- Photon emission (electroluminescence) localization techniques -- Microthermography -- Laser and particle beam-based localization techniques -- Deprocessing -- General imaging techniques -- Local deprocessing and imaging -- Materials analysis techniques -- Important topics for semiconductor devices -- FA techniques/tools roadmaps -- FA operation and management -- Appendix.
Local Note
eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America
Subject
Microelectronics -- Materials -- Testing -- Handbooks, manuals, etc.
Microelectronics -- Materials -- Testing.
Genre/Form
Handbooks and manuals.
Subject
Microelectronics.
Microelectronics -- Defects -- Testing -- Handbooks, manuals, etc.
Testing.
Electronic apparatus and appliances -- Testing -- Handbooks, manuals, etc.
Electronic apparatus and appliances -- Testing.
Electronics -- Materials -- Testing -- Handbooks, manuals, etc.
Electronics -- Materials -- Testing.
Electronics -- Materials.
Electronics -- Materials -- Defects -- Handbooks, manuals, etc.
Electronics -- Materials -- Defects.
Genre/Form
Electronic books.
Handbooks and manuals.
Added Author
Electronic Device Failure Analysis Society. Desk Reference Committee.
ASM International.
Other Form:
Print version: Microelectronics failure analysis. Materials Park, Ohio : ASM International, ©2004 (OCoLC)57017140
ISBN
9781615032662 (electronic book)
1615032665 (electronic book)
9780871708045
0871708043