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Conference International Symposium for Testing and Failure Analysis (38th : 2012 : Phoenix Convention Center)

Title ISTFA 2012 : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA.

Publication Info. Materials Park, Ohio : ASM International, 2012.
Online access
Online eBook. Access restricted to current Rider University students, faculty, and staff.
Instructions for reading/downloading the EBSCO version of this eBook

Item Status

Description 1 online resource (xxi, 620 pages) : illustrations (some color)
Physical Medium polychrome
Description text file
Bibliography Includes bibliographical references and index.
Contents ""Title Page""; ""Copyright""; ""Board of Directors""; ""Organizing Committee""; ""Symposium Committee""; ""User Groups""; ""Contents""; ""2012 IPFA Best Paper""; ""Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI""; ""Emerging Concepts and Techniques""; ""Closer to the Theoretical Limit: Spherical Corrections to Aplanatic Solid Immersion Imaging with Adaptive Optics""; ""Fault Isolation of Open Defects Using Space Domain Reflectometry""; ""Localization of Dead Open in a Solder Bump by Space Domain Reflectometry""
""Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package""""Novel Plasma FIB/SEM for High Speed Failure Analysis and Real Time Imaging of Large Volume Removal""; ""FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices""; ""Fault Isolation and Failure Analysis of TSV""; ""Cross Section Analysis of Cu Filled TSVs Based On High Throughput Plasma- FIB Milling""; ""Microstructural Considerations on the Reliability of 3D Packaging""
""High-Frequency TSV Failure Detection Method with Z Parameter""""Enhanced Failure Analysis on Open TSV Interconnects""; ""Nanoprobing Techniques""; ""A New Technique for Non-Invasive Short-Localisation in Thin Dielectric Layers by Electron Beam Absorbed Current (EBAC) Imaging""; ""Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing""; ""In FAB 300 mm Wafer Level Atomic Force Probe Characterization""; ""Nanoelectronic Analog Circuit PFA � The Return of Circuit Level Probing""; ""Fault Isolation and Failure Analysis of 3D Packages""
""Enhanced Comparison of Lock-in Thermography and Magnetic Microscopy for 3D Defect Localization of System in Packages""""Non Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-ray Computed Tomography""; ""Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies""; ""Nanoprobing Applications""; ""Analysis of an Anomalous Transistor Exhibiting Dual-Vt Characteristics and Its Cause in a 90 nm Node CMOS Technology""
""Study of Static Noise Margin, Cell Stability and Influence of Electron Beam on Sub-30 nm SRAM Using SEM-Based Nanoprobing with 8 Nanoprobes""""Leaky Device Channel Anomaly Identification and Case Study by Nano-Probing Technique, Curve Fitting, and Model Analysis""; ""Photon Based Techniques: An Understanding""; ""Photon Emission Spectra of FETs as Obtained by InGaAs Detector""; ""Near-Infrared Photon Emission Spectroscopy Trends in Scaled SOI Technologies""
Local Note eBooks on EBSCOhost EBSCO eBook Subscription Academic Collection - North America
Subject Electronics -- Materials -- Testing -- Congresses.
Electronics -- Materials -- Testing.
Electronics -- Materials.
Electronic apparatus and appliances -- Testing -- Congresses.
Electronic apparatus and appliances -- Testing -- Congresses.
Genre/Form Electronic books.
Conference papers and proceedings.
Conference papers and proceedings.
Other Form: Print version: International, ASM. ISTFA 2012 : Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis. Materials Park : A S M International, ©2012 9781615039791
ISBN 9781615039951 (electronic book)
1615039953 (electronic book)
9781680155129 (electronic book)
1680155121 (electronic book)
1615039791
9781615039791

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