LEADER 00000cam a2200733Ii 4500 
001    ocn934678500 
003    OCoLC 
005    20190705070152.8 
006    m     o  d         
007    cr un||||||||| 
008    160113t20152016enka    ob    001 0 eng d 
019    934770014|a1067242723 
020    9781849199353|q(ePDF) 
020    1849199353|q(ePDF) 
020    9781523101009 
020    1523101008 
020    |z9781849199346|q(hardback) 
020    |z1849199345|q(hardback) 
035    (OCoLC)934678500|z(OCoLC)934770014|z(OCoLC)1067242723 
037    887548|bMIL 
040    YDXCP|beng|erda|epn|cYDXCP|dOCLCO|dCN3GA|dOCLCQ|dXII
       |dOCLCF|dUIU|dCUS|dSTF|dIDEBK|dEBLCP|dN$T|dKNOVL|dWAU|dOTZ
       |dOCLCQ|dMERUC|dINT|dOCLCQ|dUWO|dOCLCQ 
049    RIDW 
050  4 TK7874|b.O37 2016 
072  7 TEC|x009070|2bisacsh 
072  7 B0100|2inspec 
072  7 B0170J|2inspec 
072  7 B2570|2inspec 
072  7 B7230|2inspec 
072  7 B7320R|2inspec 
082 04 621.4|223 
090    TK7874|b.O37 2016 
100 1  Ogrenci-Memik, Seda,|0https://id.loc.gov/authorities/names
       /nb2016008955|eauthor. 
245 10 Heat management in integrated circuits :|bon-chip and 
       system-level monitoring and cooling /|cSeda Ogrenci-Memik.
264  1 London, United Kingdom :|bThe Institution of Engineering 
       and Technology,|c2015. 
264  4 |c©2016 
300    1 online resource (ix, 253 pages) :|billustrations. 
336    text|btxt|2rdacontent 
337    computer|bc|2rdamedia 
338    online resource|bcr|2rdacarrier 
347    text file|2rdaft 
490 1  Materials, circuits and devices series ;|v28 
504    Includes bibliographical references and index. 
505 0  Heat in integrated circuits and systems -- On-chip 
       temperature sensing -- Dynamic thermal management -- 
       Active cooling -- Mitigating thermal events at the system 
       level and above -- Emerging directions in thermal-aware 
       systems. 
520    "As integrated circuits get smaller and more complex, 
       power densities are increasing, leading to more heat 
       generation. Dealing with this heat is fast becoming the 
       most important design bottleneck of current and future 
       integrated circuits, where power envelopes are defined by 
       the ability of the system to dissipate the generated heat.
       Thermal effects are forcing chip designers to apply 
       conservative design margins, creating sub-optimal results.
       At a larger scale, cooling is the second most costly item 
       in the electricity bills of well-designed high-performance
       computing and data centers, costing 30-50% of the total. 
       Thermal monitoring and management in integrated circuits 
       is therefore becoming increasingly important. This book 
       covers thermal monitoring and management in integrated 
       circuits, with a focus on devices and materials that are 
       intimately integrated on-chip as opposed to in-package or 
       on-board. The devices and circuits discussed include 
       various designs used for the purpose of converting 
       temperature to a digital measurement and actively biased 
       circuits that reverse thermal gradients on chips for the 
       purpose of cooling. Topics covered include an overview of 
       heat in integrated circuits and systems, on-chip 
       temperature sensing, dynamic thermal management, active 
       cooling, and mitigating thermal events at the system-level
       and above"--Provided by publisher. 
588 0  Print version record. 
590    eBooks on EBSCOhost|bEBSCO eBook Subscription Academic 
       Collection - North America 
650  0 Integrated circuits|xDesign and construction.|0https://
       id.loc.gov/authorities/subjects/sh85067118 
650  0 Electronic circuits|xTemperature compensation.|0https://
       id.loc.gov/authorities/subjects/sh85042281 
650  0 Temperature measuring instruments.|0https://id.loc.gov/
       authorities/subjects/sh89005777 
650  0 Temperature control.|0https://id.loc.gov/authorities/
       subjects/sh85133715 
650  7 Integrated circuits|xDesign and construction.|2fast|0https
       ://id.worldcat.org/fast/975545 
650  7 Electronic circuits|xTemperature compensation.|2fast
       |0https://id.worldcat.org/fast/906897 
650  7 Temperature measuring instruments.|2fast|0https://
       id.worldcat.org/fast/1147370 
650  7 Temperature control.|2fast|0https://id.worldcat.org/fast/
       1147347 
655  4 Electronic books. 
776 08 |iPrint version:|aOgrenci-Memik, Seda.|tHeat management in
       integrated circuits.|dLondon, United Kingdom : The 
       Institution of Engineering and Technology, 2015
       |z9781849199346|w(OCoLC)935526988 
830  0 Materials, circuits and devices series ;|0https://
       id.loc.gov/authorities/names/no2016019132|v28. 
856 40 |uhttps://rider.idm.oclc.org/login?url=http://
       search.ebscohost.com/login.aspx?direct=true&scope=site&
       db=nlebk&AN=1140095|zOnline eBook via EBSCO. Access 
       restricted to current Rider University students, faculty, 
       and staff. 
856 42 |3Instructions for reading/downloading the EBSCO version 
       of this eBook|uhttp://guides.rider.edu/ebooks/ebsco 
901    MARCIVE 20231220 
948    |d20190709|cEBSCO|tEBSCOebooksacademic NEW 7-5-19 5915
       |lridw 
994    92|bRID